A increased requirement for carbon and oxygen concentration in wafer substrates can be addressed by Nanometrics’ high sensitive detectors. The outstanding sensitivity is a result of more than 20 years of expertise in FTIR and at the end there is the Nanometrics QS FTIR product line - the industry leader for table top and fully automated production monitoring. Wafer back side processing to build a diffusion barrier requires the build of a Si and polysilicon layers on rough surfaces.
The newly introduced NanoSpec II delivers enhanced wavelength metrology along with the most advanced modeling engine in the industry. from very thin to very thick Si layers, from polished to high roughness substrates, the NanoSpec II will give customers the ability to monitor the wafer back side process even at very narrow process windows.